Description
Product Overview
Multilayer Flexible Printed Circuit Boards (Multilayer FPCs) are high-performance interconnect components composed of alternating layers of flexible substrates and conductive copper. Compared to single/double-sided FPCs, multilayer FPCs enable more complex circuit designs through interlayer connections (e.g., laser drilling, plated through-holes), making them suitable for high-density, high-reliability electronic devices.
Multilayer FPCs are widely used in consumer electronics, automotive electronics, medical devices, aerospace, and 5G communications, meeting demands for miniaturization, lightweight design, and bendability.
Flexible PCB Parameters
Item |
Flexible PCB |
Max Layer |
8L |
Inner Layer Min Trace/Space |
3/3mil |
Out Layer Min Trace/Space |
3.5/4mil |
Inner Layer Max Copper |
2oz |
Out Layer Max Copper |
2oz |
Min Mechanical Drilling |
0.1mm |
Min Laser Drilling |
0.1mm |
Aspect Ratio(Mechanical Drilling) |
10:1 |
Aspect Ratio(Laser Drilling) |
/ |
Press Fit Hole Ttolerance |
±0.05mm |
PTH Tolerance |
±0.075mm |
NPTH Tolerance |
±0.05mm |
Countersink Tolerance |
±0.15mm |
Board Thickness |
0.1-0.5mm |
Board Thickness Tolerance(<1.0mm) |
±0.05mm |
Board Thickness Tolerance(≥1.0mm) |
/ |
Impedance Tolerance |
Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) |
Differential:±5Ω(≤50Ω),±10%(>50Ω) |
Min Board Size |
5*10mm |
Max Board Size |
9*14inch |
Contour Tolerance |
±0.05mm |
Min BGA |
7mil |
Min SMT |
7*10mil |
Surface Treatment |
ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating |
Solder Mask |
Green Solder Mask/Black PI/Yellow PI |
Min Solder Mask Clearance |
3mil |
Min Solder Mask Dam |
8mil |
Legend |
White,Black,Red,Yellow |
Min Legend Width/Height |
4/23mil |
Strain Fillet Width |
1.5+0.5mil |
Bow & Twist |
/ |

Product Features
-
High-Density Wiring
-
Utilizes fine-line technology (line width/spacing as low as 30/30μm) and blind/buried vias to enhance circuit integration.
-
Suitable for chip-scale packaging (CSP), high-pin-count BGAs, and other precision components.
-
Excellent Flexibility
-
Uses polyimide (PI) or liquid crystal polymer (LCP) substrates, allowing repeated bending (dynamic applications can withstand millions of cycles).
-
Supports 3D installation, adapting to complex spatial layouts.
-
High Reliability and Stability
-
Resistant to high temperatures (PI substrates can withstand reflow soldering above 260°C) and chemical corrosion.
-
Low dielectric loss, ideal for high-frequency and high-speed signal transmission (e.g., 5G mmWave).
-
Lightweight and Thin Design
-
Thickness can be controlled below 0.1mm, weighing over 70% less than rigid PCBs.
-
Suitable for weight-sensitive applications such as wearables and foldable smartphones.
Product Advantages
Comparison |
Multilayer FPC |
Traditional Rigid PCB |
Single/Double-Sided FPC |
Flexibility |
Excellent (dynamic bending) |
None |
Good (static bending) |
Wiring Density |
Very high (multilayer interconnects) |
High |
Moderate |
Weight |
Extremely light |
Heavy |
Light |
High-Frequency Performance |
Excellent (LCP substrate) |
Good |
Average |
Cost |
Higher (complex process) |
Low |
Moderate |
Manufacturing Process
Multilayer FPC production is more complex than standard PCBs, with critical processes including:
-
Material Preparation
-
Inner Layer Patterning
-
Lamination and Through-Hole Plating
-
Surface Treatment
-
Testing and Validation
-
Flying probe testing (electrical performance)
-
Bend cycle testing (dynamic applications require ≥100,000 cycles)
Applications
-
Consumer Electronics
-
Automotive Electronics
-
Medical Devices
-
Industrial & Communications
-
Aerospace

Frequently Asked Questions (FAQ)
Q1: What file formats do you accept for PCB manufacturing?
We support all industry-standard formats, including:
– Gerber (RS-274X)
– PROTEL (99SE & DXP)
– CAM350
– ODB++ (.TGZ)
– Eagle
– Altium Designer
– PADS
Q2: How do you protect my design files and intellectual property?
We take data security extremely seriously. Your design files are:
– Stored on encrypted servers
– Only accessible to your dedicated project team
– Never shared with third parties without your explicit written consent
– Automatically purged after project completion (unless otherwise requested)
Q3: What payment methods do you accept?
We offer flexible payment options:
Electronic Payments:
– PayPal
– AliPay
– Credit Cards (Visa/MasterCard/UnionPay)
Bank Transfers:
– T/T (Telegraphic Transfer)
– Western Union
– L/C (Letter of Credit)
Q4: What are your shipping options?
We provide global logistics solutions:
Express Shipping (1-5 days):
– DHL
– FedEx
– UPS
– EMS
Bulk Shipping:
– Air freight (>300kg)
– Sea freight (Full container options)
– Can accommodate your preferred freight forwarder
Q5: What is your minimum order quantity?
We specialize in both:
– Prototype quantities (1 piece available)
– High-volume production
No minimum order value requirements
Q6: Can we visit your manufacturing facilities?
We welcome client visits to our facilities:
Main Facility:
Shenzhen, China (ISO 9001 certified)
Secondary Facility:
Guangdong Province, China
Please contact us to schedule a tour with our engineering team
Q7: How do you guarantee PCB quality?
Our comprehensive quality assurance includes:
Testing:
– 100% Electrical Testing (Flying Probe & E-Test)
– Automated Optical Inspection (AOI)
Certifications:
– IPC Class 2/3 standards
– ISO 9001:2015 certified
– UL certified (upon request)
Additional Services:
– Free DFM analysis
– 3D model verification
– Cross-section analysis available
All PCBs come with our quality guarantee and full traceability documentation.